Okuma/SAP Partnership Post-show Announcement

Okuma America is pleased to offer our customers increased information management capabilities thanks to the joint efforts of Okuma and SAPAmerica, Inc., the newest member of Partners in THINC.

Through this partnership SAP’s Manufacturing Integration and Intelligence (SAP MII) application will be merged with the power of the THINC OSP to create a seamless information exchange solution. As a result, business operations will be directly connected to the plant floor allowing for immediate, real-time flow of mission-critical data between the manufacturing equipment and the business office. This solution, which is a perfect example of the collaborative nature of Partners in THINC, answers customers’ demands for even greater efficiency and control in the manufacturing environment, ultimately improving bottom line results.

By merging SAP MII with the THINC control, Okuma and SAP enable customers to experience reduced operating costs, increased return on asset usage, improved compliance and quality standards and an improved ability to meet both internal and external production demands. Because this solution puts the necessary information directly in the hands of those who need it, when they need it, and allows individuals to act upon real data, the potential for process improvement and increased performance is unprecedented. The result is an even greater competitive advantage for Okuma customers.

This agreement is made possible by the shared visions of Okuma and SAP. Both companies are committed to focusing on core competencies and leveraging partnerships to achieve results for our clients. Partners in THINC is the ultimate setting for such innovation and collaboration. As a result, our customers can let their imaginations and expectations soar. There are no limitations to the thinking of how to use the power of SAP business solutions or the power of third- and fourth-party hardware and software through the Okuma THINC control.